- wusheng888@126.com
- Monday-Friday:09:30 pm-05:00pm
- Address: Unit 1111, 11/F, Hollywood Plaza, 610 Nathan Road, Mongkok, Kowloon, HongKong.
1.GRIND
If purchasing unground, unsawn wafers, then it is recommended that the
wafers should be ground down from 675 µm down to 300 µm thick.
2.SAW
Die stepping pitch is 0.63mm x 0.53mm with 72 µm saw channel. Total
number of die per wafer is 48549.
3.PACKAGING
Bond pad location as viewed on wafer with major flat to the bottom. Bond pads
are 100 µm x 100 µm.
The LXD/GB5-A1 is a low cost ambient light sensor, with a current output directly proportional to the light level. The output current can be converted to a voltage with an external resistor. The resistor value sets the dynamic range of the sensor. The LXD/GB5-A1 has excellent noise (dark current) cancelling. Ideal for low LUX sensing at high temperature. It has a built in optical filter to provide a visible response much like the human eye.
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