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236.00 x 236.00 mils Silicon Photodiode Chip

236.00 x 236.00 mils Silicon Photodiode Chip

This is an overview of 236.00 x 236.00 mil silicon photodiode chips. We can assist customers in technology development by providing 3-inch (traditional diffusion process) or 6-inch (particle injection process) silicon wafer plate drawings or customized designs, helping customers in the field of optoelectronic detection with technology research and development, related new product derivatives, and scientific research. We retail chips or provide you with finished products in different packaging forms, such as TO metal, ceramic SMT、 Arrays and modules, etc.

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236.00 x 236.00 mils Silicon Photodiode Chip

1. Scope : 
This specification applies to PN silicon photodiode chips, 
Device No. LXD-PN236236. 
2. Structure : 
2-1. Planar type : P on N diode. 
2-2. Electrodes : 
Top side (Anode ) : Aluminum alloy . 
Back side (Cathode ) : Gold alloy . 
3. Size : 
3-1. Chip size : 236 mils Ø 236 mils ( 6 mm Ø 6 mm ). 
3-2. Chip thickness : 15 ² 1.5 mils ( 0.381² 0.038 mm ). 
3-3. Active area : 223 mils Ø 223 mils ( 5.67 mm Ø 5.67 mm ). 
3-4. Bonding pad (Anode ) : 8 mils Ø 8 mils ( 0.2 mm Ø 0.2 mm ). 
3-5. Pattern drawing : Refer to the attached drawing. 

4. Electro-optical characteristics (Ta = 25 к)

Parameter Symbol Condition Min Typ Max Unit
Reverse dark 
Current
ID VR=5V 
Ee=0mW/‌cm²‌
    100 nA
Reverse breakdown 
voltage
V(BR)R IR=20uA 
Ee=0mW/‌cm²‌
10     V 
Forward 
Voltage 
VF(L) IF=100uA 0.35     V 
Short circuit 
Current 
Isc T=2856K 
Ee=5mW/‌cm²‌
  300   uA
Turn-on/ 
Turn-off 
Time 
ton/toff VR=5V 
RL=50Ω
入=850nm
  150/150   nS

*Based on 100% probing 

 

---

 

1. Scope : 
This specification applies to PN silicon photodiode chips, 
Device No. LXD-PN236236A. 
2. Structure : 
2-1. Planar type : P on N diode. 
2-2. Electrodes : 
Top side (Anode ) : Aluminum alloy . 
Back side (Cathode ) : Gold alloy . 
3. Size : 
3-1. Chip size : 236 mils Ø 236 mils ( 6 mm Ø 6 mm ). 
3-2. Chip thickness : 15 ² 1.5 mils ( 0.381² 0.038 mm ). 
3-3. Active area : 223 mils Ø 223 mils ( 5.67 mm Ø 5.67 mm ). 
3-4. Bonding pad (Anode ) : 8 mils Ø 8 mils ( 0.2 mm Ø 0.2 mm ). 
3-5. Pattern drawing : Refer to the attached drawing. 

4. Electro-optical characteristics (Ta = 25 к)

Parameter Symbol Condition Min Typ Max Unit
Reverse dark 
Current
ID VR=5V 
Ee=0mW/‌cm²‌
    30 nA
Reverse breakdown 
voltage
V(BR)R IR=20uA 
Ee=0mW/‌cm²‌
30     V 
Forward 
Voltage 
VF(L) IF=100uA     1.2 V 
Short circuit 
Current 
Isc T=2856K 
Ee=5mW/‌cm²‌
  320   uA
Turn-on/ 
Turn-off 
Time 
ton/toff VR =5V 
Ee=0mW/cm2
f=1MHZ 
  150/150   nS

*Based on 100% probing 

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